标题:
Strain relief apparatus for probe and method of manufacturing the same
当前申请(专利权)人:
SAMSUNG MEDISON CO., LTD.
发明人:
WOO, KYEONG GU | LEE, SUN KI
简单同族:
EP2324770A1 | EP2324770B1 | JP2011104372A | KR101232622B1 | KR1020110055881A | US20110123256A1 | US9049980