标题:
Capacitive micromachined ultrasonic transducer (CMUT) device with through-substrate via (TSV)
当前申请(专利权)人:
TEXAS INSTRUMENTS INCORPORATED
发明人:
JOHNSON, PETER B. | WYGANT, IRA OAKTREE
简单同族:
CN105025802A | CN105025802B | JP2016511607A | JP2016511607A5 | JP6337026B2 | US10335827 | US20140239769A1 | US20170050217A1 | US9520811 | WO2014134301A1