标题:
Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays
当前申请(专利权)人:
KONINKLIJKE PHILIPS ELECTRONICS N V
简单同族:
CN1890031A | CN1890031B | EP1691937A1 | EP1691937B1 | JP2007515268A | JP4773366B2 | US20070276238A1 | US7741756 | WO2005053863A1