标题:
Ultrasonic transducer element package, ultrasonic transducer element chip, probe, probe head, electronic device, ultrasonic diagnostic apparatus, and method for producing ultrasonic transducer element package
当前申请(专利权)人:
SEIKO EPSON CORPORATION
简单同族:
CN103505242A | CN103505242B | EP2684617A1 | JP2013258624A | JP6047936B2 | KR1020130140573A | US20130338502A1 | US9826961