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标题
授权日
公开（公告）号
申请日
公开（公告）日
当前申请（专利权）人
发明人
操作

半導体装置、超音波撮像装置、半導体装置の製造方法及び超音波イメージングシステム
1900-01-01
JPWO2017056355A1
2016-07-15
2018-08-02
ソニー株式会社
森本類
注释

Ultrasound diagnosis apparatus and method of controlling the same
1900-01-01
US20140128736A1
2013-10-03
2014-05-08
SAMSUNG MEDISON CO., LTD.
JO, JAE MOON
注释

Ultrasonic measurement apparatus and ultrasonic measurement method
1900-01-01
US20150216500A1
2015-01-22
2015-08-06
SEIKO EPSON CORPORATION
MANO, TOMONORI | TSUKIASHI, NORIO
注释

Ultrasound transducer, ultrasound probe including the same, and ultrasound diagnostic equipment including the ultrasound probe
1900-01-01
US20140221840A1
2013-09-25
2014-08-07
SAMSUNG MEDISON CO., LTD.
KO, JONG-SUN | JIN, GIL-JU | PARK, JUNG-LIM | KIM, DONG-HYUN
注释

Ultrasonic probe, method of working the same, and mounting device
2019-03-26
US10241089
2015-09-11
2019-03-26
SAMSUNG ELECTRONICS CO., LTD.
CHUNG, HAE-IN | KIM, TAE-KYUNG | LIM, SU-KWANG
注释

Ultrasonic probe and ultrasonic imaging apparatus
1900-01-01
US20150119718A1
2014-10-06
2015-04-30
SAMSUNG MEDISON CO., LTD.
JIN, GIL JU | KWON, SUNG DO
注释

Ultrasound transducer and method for wafer level back face attachment
1900-01-01
US20200107814A1
2019-12-04
2020-04-09
GE PRECISION HEALTHCARE LLC
DALOZ, FLAVIEN | BARRETT, JASON | DA CRUZ, EDOUARD | MALACRIDA, JEAN PIERRE
注释

Ultrasound transducer and method for wafer level back face attachment
1900-01-01
US20180175278A1
2016-12-20
2018-06-21
GENERAL ELECTRIC COMPANY
DALOZ, FLAVIEN | BARRETT, JASON | DA CRUZ, EDOUARD | MALACRIDA, JEAN PIERRE
注释

Ultrasound transducer and method for wafer level back face attachment
2020-02-18
US10561398
2016-12-20
2020-02-18
GENERAL ELECTRIC COMPANY
DALOZ, FLAVIEN | BARRETT, JASON | DA CRUZ, EDOUARD | MALACRIDA, JEAN PIERRE
注释